The Wall Street chimed in with its insider information on the rumored iPhone 5. According to the report, Apple’s next generation iPhone will be thinner and lighter than the iPhone 4. It also may include an 8-megapixel camera, which is a nice boost from the 5-megapixel shooter on the current model.
Qualcomm will supposedly provide the wireless baseband chips which suggests the handset may be a world phone capable of connecting to both CDMA and GSM networks. Apple apparently expects the iPhone 5 to be popular and has warned suppliers it plans to ship 25 million units by the end of the year.
Foxconn will be the assembler for the rumored iPhone, but these yields may be lower than Apple wants as the iPhone 5 is described as being complicated and difficult to assemble. We’re not sure what that means, but it is intriguing.
WSJ: Apple prepping thinner, lighter iPhone 5 originally appeared on TUAW – The Unofficial Apple Weblog on Wed, 06 Jul 2011 10:30:00 EST. Please see our terms for use of feeds.
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